Method for producing large lighting with power led

ABSTRACT

The present invention relates to a method for manufacturing large lighting which uses a power LED, such as for large LED lighting for street lamps, which incorporates a heat dissipation device that has the ability to dissipate heat with natural convection to maintain ambient temperature. The disclosed method is novel applied technology for producing a large LED lighting, such as for street lamps, which has a power LED device with a unique, rear heat dissipation capability. In addition to maximum thermal efficiency by heat dissipation, the present LED lighting system also increases luminous efficiency by providing high light emission with only a small quantity of LED power.

TECHNICAL FIELD

The present invention relates to a method for producing a large lightingwith a power LED, and in particular to a method for producing a largelighting with a power LED which makes it possible to fast disperse, in amultiplexing way, a high temperature heat of a large LED lighting like astreetlight into the temperature of the atmosphere by way of a naturalconvection type heat radiation device.

BACKGROUND ART

In recent years, as it is urgently needed to reduce the uses of CO₂, SO₂and NO₂ which are the key factors to global warming, a new lightingdevelopment is inevitable, which might attract a big attention as atechnology of a green growth helping significantly reduce powerconsumption and resource waste, maximize the efficiency of light sourceand embody the coexistence of green and growth.

The LED (Light Emitting Diode) lighting using a LED has the advantagesin terms of both the low power consumption and a semi-permanentenvironment and economic use. It is known to be environmentally friendlywith the features that it has a long service life eight times longerthan a neon fluorescent lighting, and it has a power consumption 67%lower than an incandescent lamp has, and 17% lower than a fluorescentlighting has, and it uses a mercury free light source which isenvironmentally friendly; however there are still a lot of problems tobe resolved, in view of the efficiencies of light emission.

The LED lighting is generally made by binding one or multiple LEDdevices together which emit red, green and blue colors when electricpower is applied to them. The light emitting principle of the LED wasobserved as light was emitted when applying electric power to asemiconductor in 1907. The electron (e) of the semiconductor has acertain deviation in energy as energy is externally supplied. At themoment electron changes from a higher energy to a lower energy, lightemits. When the difference between energies is large, blue color lightemits, when small, a red color light emits, and when middle, a greencolor light emits. The red color LED was for the first timecommercialized by the US general electronic (GE) in 1962, and the bluecolor LED was developed by Shuji Nakamura of Nichia Corporation in 1993.The Nichia Corporation developed a white color LED which emitted a whitecolor light in such a way to adapt a yellow color fluorescent substanceto a blue color LED in 1997. Afterward, the LED can emit various colorsby combining together red, green and blue colors, even white color. Asthe white color LED was developed, it became possible to set up afoundation for the purpose of producing a lamp which can substitute anordinary lighting in the field of an electronic display product.

The LED lighting, which uses a LED substituting an ordinary lighting,might be further intensively developed for a research and developmentfor various applications with the aid of an original technology. Interms of the technology of the level of Lumen/Watt [lm/W] representing alight emitting efficiency of a high luminance LED, many leadingcompanies are competitively developing products with the highest lightsource efficiencies. Nowadays, the US Cree company, the Germany Osramcompany and the Japan Nichia company account for almost the marketshares as they produce most of the related products.

The high luminance power LED lighting produces 3.3V of VF voltage and700 mA of IF current based on 3 W-level criteria; however it has aproblem that a heat radiation of a high temperature heat at a backsideof a power LED generating during a procedure that light emits as a largecurrent is applied to a small LED device is hard, generating a bigissue.

The power LED, which is a high output LED above 1 watt (W) is known toconsume a lot of electric power, and since the current amount is large,a light emitting efficiency is high; however a heating level of a LEDchip seems to be high, which needs a proper measurement, otherwise thetemperature of a LED chip rises too high, thus degrading a chip itselfor a packaging resin. Subsequently, a light emitting efficiency islowered, for example luminance is lowered, and a service life of a chipis shortened. So, it is necessarily needed to develop a heat radiationtechnology so that a semi-permanent life span of a LED, which is one ofthe biggest features, cannot be degraded.

In order for a LED to be used for the purpose of a light source forlighting, a modulation technology of it is necessary needed, the keytechnology of which is related to a heat radiation design based on apackage material. The heat radiation design technology is a keytechnology needed for the purpose of manufacturing a lighting productusing a LED.

The power LED package, which is currently used, has a variety of kindsand is generally used for the purpose of a PCB (Printed Circuit Board)type and a horizontal type; however the common matters of them lie inthat the volume increase since a high luminance power LED is used in aPCB state. Besides, there is a limit in increasing the output now that alot of heat occurs as much as the consuming electric power since theconsuming electric power is 0.5˜1 watt even though the size of the usedchip is 20, 28, 40 mil ( 1/1000 inches).

The most important matter in terms of a power LED is the loss of a chipdue to heat. The aging of the LED goes on fast due to the heat, and theluminance is lowered. In order to resolve the above mentioned problems,domestic and foreign related companies are competitively developing heatsinking planes and are also researching a method for a high efficiencywith a lower electric current. Light energy is directed to a thing whichemits light with heat itself, so it cannot emit light without generatingheat. The important matter lies in that how much heat is actuallyconverted into light energy in order to enhance the efficiency ofproducts, which results in good competitiveness.

In other words, if a heating point temperature is maintained constantlyby applying a VF voltage and an IF current to a power LED, the LED mightbe considered as the LED light source having the highest light emittingefficiency on the earth (refer to FIG. 1); however the problems in termsof the backside heat radiation process technology of the power LEDbasically remains unresolved, instead it is known to control somehow theheating in such a way that the light emitting efficiency of the powerLED device is lowered 30˜40% by driving with the current of a tens mA bylowering the VF voltage and the IF current to a degree low enough not toturn off the device of the power LED or in such a way that the voltageis raised, fixing the current. In more details, if the voltage is 3watt, the use of 700˜750 mA is normal; however the currently appliedtechnology is directed to resolving the heat radiation problems byreducing the heat generation in such a way to lower the current ascompared with the output by packaging in a form that the voltage isincreased, and the current is fixed.

When using the power LED in a place where needs a large light sourcesuch as streetlights, security lamps, park lamps, tunnel lamps, factorylamps, plaza halo lamps, angling lamps, military lamps for specialoperations, search light lamps, etc., it is needed to upgrade the systemefficiency of the LED device to 70˜85% by driving with a hundreds mA ofcurrent rather than to decrease the VF voltage and the IF current.

In Korea, a LED light source module for a white lighting of 2500lumen/watt [lm/W] and a heat resistance 1 Kelvin/watt (K/W) has beendeveloped, which can be adapted to a head light of a vehicle; however itneeds 70 heat radiation chips for 0.95 K/W of a heat resistance for thesake of heat radiation process.

Since a relatively high heat generates at a heat radiation point of aheating portion of a backside of a power LED, the heat radiation processproblem should be resolved, so it seems that only the high luminancepower LED lighting appliances with a heat radiation process function canhave competitiveness.

So, the present invention is directed to proposing a new appliedtechnology as to a backside heat radiation design in terms of a powerLED device for the purpose of the manufacture of a large LED lightingappliance.

DISCLOSURE OF INVENTION

Accordingly, the present invention is made in an attempt to resolve theabove-mentioned problems, and it is an object of the present inventionto provide a method for producing a large lighting with a power LEDwhich makes it possible to fast disperse, in a multiplexing way, theheat into the temperature of the atmosphere, which is accumulated bymeans of a heat transfer medium in a multi-through hole which lets aheat radiation point of a heat radiation portion of a backside of apower LED come into direct contact with an aluminum structure which is alarge heat radiation structure, so a large light source can be emittedwith less LEDs by maximizing the efficiency of heat radiation, thusenhancing the efficiency of a light source of a LED device, whichconsequently results in the production of a large LED lightingappliance.

To achieve the above-mentioned objects,

there is provided a method for producing a large lighting with a powerLED which comprises,

(A) a step in which one through hole is formed by means of a punchingprocess at part of an upper side in order for a double-sided substratenot to be passed depending on the shape and size of the power LED in thedouble-sided substrate (FR-4 PCB) in which a Cu thin surface is attachedat the upper and lower portions made from a FR-4 material having asolder pad which can fix a lead frame (+pole and −pole) of the powerLED;

(B) a step in which a plurality of through holes are formed by passingthrough the remaining parts of the double-sided substrate extended fromone through hole, so a multi-through hole of a two-tiered structure isformed in such a way that a lower Cu thin surface of a double-sidedsubstrate (FR-4 PCB) is not punched;

(C) a step in which a Pb-free cream solder is injected in themulti-through hole of a two-tiered structure as much as the height ofthe solder pad for the purpose of providing a heat slug function byusing a mechanical device;

(D) a step in which a PCB assembly (PCB Assy) is finished by soldering aPb-free cream solder for the purpose of ensuring that the heat radiationpoint of the heating portion of a backside of the power LED and thePb-free cream solder and the lower Cu thin surface of the double-sidedsubstrate are integrated, by using a movable high temperature equipmentafter the power LED is properly positioned at the pole plates followingthe injection of the Pb-free cream solder; and

(E) a step in which the PCB assembly is engaged to an aluminum structurewhich is a large heat radiation structure, thus maximizing the heatradiation efficiency of the LED lighting.

Preferably, it is characterized in that the multi-through hole of atwo-tiered structure is punched at a portion where is vertically matchedwith a heat radiation point of the power LED heating portion.

Preferably, it is characterized in that the multi-through hole of atwo-tiered structure is previously punched when processing thedouble-sided substrate (FR-4 PCB).

Preferably, it is characterized in that the multi-through hole of atwo-tiered structure is formed in a circular shape or a quadrangleshape.

Preferably, it is characterized in that the one through hole has afunction by which the Pb-free cream solder injected in one through holebecomes a thermal transfer medium of a Pb soldering structure by meansof a movable high temperature equipment, thus fast accumulating a hightemperature heat coming from a heat radiation point of the power LEDheating portion.

Preferably, it is characterized in that the plurality of the throughholes have functions of dispersing, in a multiplexing way and a fastflow speed type, a high temperature heat fast accumulated in one throughhole.

Preferably, it is characterized in that the Pb-free cream solder isinjected before the power LED is engaged to the double-sided substrate(FR-4 PCB).

Preferably, it is characterized in that the PCB assembly and saidaluminum structure, which is a large heat radiation structure, arefixedly attached by a soldering or a thermal grease.

ADVANTAGEOUS EFFECTS

The present invention has the following advantageous effects.

It is advantageous that the present invention makes it possible to fastdisperse and radiate the heat into the temperature of the atmosphere,which heat is accumulated by means of a heat transfer medium in amulti-through hole which lets a heat radiation point of a heat radiationportion of a backside of a power LED come into direct contact with analuminum structure which is a large heat radiation structure.

(1) So, a large light source can be emitted with less LEDs by maximizingthe efficiency of heat radiation, thus enhancing the efficiency of alight source of a LED device.

(2) As the heat radiation process is reliable, it is possible tomanufacture a large LED lighting appliance such as a streetlight.

(3) The present invention provides a unique effect which helps introducea new applied technology on a heat radiation design of a backside of apower LED device for the sake of the production of a large LED lightingappliance.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1(A), (B) is a graph showing a theoretical review on a VF-IFcharacteristic of a power LED and a heat radiation efficiency and aservice life.

FIG. 2 is a view illustrating a common structure of a power LED.

FIG. 3(A), (B), (C) is a view illustrating a PCB assembly (PCB Assy)manufacture procedure based on a method for producing a large lightingwith a power LED according to a preferred embodiment of the presentinvention.

FIG. 4 is a view illustrating a PCB assembly (PCB Assy) finished basedon a method for producing a large lighting with a power LED according toa preferred embodiment of the present invention.

FIG. 5 is a view illustrating a state that a PCB assembly based on amethod for producing a large lighting with a power LED is fixed at analuminum structure which is a large radiation structure according to apreferred embodiment of the present invention.

FIG. 6 is a flow chart explaining a method for producing a largelighting with a power LED according to a preferred embodiment of thepresent invention.

FIG. 7 is a flow chart explaining a multi-through hole of a two-tieredstructure based on a method for producing a large lighting with a powerLED of FIG. 6.

FIG. 8 is a flow chart explaining a step that a Pb-free cream solder anda PCB assembly based on a method for producing a large lighting with apower LED are attached to an aluminum structure which is a large heatradiation structure of FIG. 6.

<Descriptions of the reference numerals of key elements of the drawing>100: power LED 101: electrode plate 110: reflection mirror 120: anode(A) 130: Au bonding wire 140: concave lens 150: cathode (K) 160: resinmold 170: convex lens 180: heating portion 190: heat radiation point200: double-sided substrate (FR-4 PCB) 210: FR-4 material 220: upper Cuthin surface 221: lower Cu thin surface 230: multi-through hole oftwo-tiered structure 231: one through hole 232a~232d: multiple throughholes 240: circular 250: quadrangle 300: Pb-free cream solder 310: heatslug 320: solder pad 400: movable type high temperature equipment PCBassembly 600: aluminum structure which is a large heat radiationstructure

MODES FOR CARRYING OUT THE INVENTION

The preferred embodiments of the present invention will be describedwith reference to the accompanying drawings. As to giving the referencenumerals to the elements of each drawing, it is noted that the sameelements are given the same reference numerals even when they are shownon different drawings. In addition, in the middle of the explanation ofthe present invention, when it seems that the detailed descriptions onthe related known constructions or functions might make the subjectmatters of the present invention unclear, they will be omitted from thedetailed descriptions.

FIG. 1(A), (B) is a graph showing a theoretical review on a VF-IFcharacteristic of a power LED and a heat radiation efficiency and aservice life.

As shown in FIG. 1, if the light emitting output of the high luminancepower LED is 3 W, since it is possible to maintain constant thetemperature of the heating point when 3.3V of the VF voltage and 700 mAof the IF current are supplied, it is possible to keep the advantages ofa long life service of the LED which can keep a light emittingefficiency of above 100% for 1,000 hours, above 95% of 10,000 hours, andabove 90% of 100,000 hours.

It is needed to flow a large current of above a hundred mA in order touse a high luminance power LED for the sake of lighting. Here, thetemperature of the LED chip rises too high, and the chip itself or thepacking resin is thermally degraded, so the luminance drops or the lightemitting efficiency is worsened or the service life of the chip isreduced. The development of the heat radiation design technology isnecessary for the purpose of maintaining a semi-permanent life servicewhich is the best feature of the LED. So, the key technology of thepresent invention lies in that the method of the present invention isimplemented in a natural convection way which helps radiate a hightemperature heat coming from the LED chip to the temperature of theatmosphere.

FIG. 2 is a view illustrating a common structure of a power LED.

As shown in FIG. 2, the high luminance power LED is constituted in sucha way that a V-shape reflection mirror 110 is fixed at an electrodeplate 101, and an anode (A) terminal 120 is connected to one side of theelectrode plate, and a semi-circular Au bonding wire (golf bonding wire)130 made of Au for the purpose of a reliable electric contact betweenmembers is bent toward the cathode (K) terminal 150. In addition, at thecenter of the V-shaped reflection mirror 110 is mounted a concave lens140, and to its lower end is connected the cathode (K) terminal 150.When voltage is supplied to the anode (A) terminal 120 and the cathode(K) terminal 150, a discharge starts, and at the same time, light emitsby means of a deviation formed as a semiconductor electron (e) transfersfrom a higher energy to a lower energy toward the cathode (K) terminal150 via the Au bonding wider 130 connected with the anode (A) terminal120. In addition, in the interior of the V-shaped reflection mirror 110is filled the resin mold 160, and on its upper side is mounted theconvex lens 170. At the power LED heating portion 180 is formed a heatradiation point 190.

FIG. 3(A), (B), (C) is a view illustrating a PCB assembly (PCB Assy) 500manufacture procedure based on a method for producing a large lightingwith a power LED according to a preferred embodiment of the presentinvention.

As shown in FIG. 3(A), a multi-though hole of a two-tiered structure isformed at the double-sided substrate (FR-4 PCB) 200 by means of apunching process depending on the shape and size of the power LED.

The double-sided substrate (FR-4 PCB) is a means for positioning thepower LED, and Cu thin surfaces 220 and 221 are attached to the upperand lower sides of the FR-4 material 210 which is formed of a solder padhelping fix the lead frame (+pole and −pole) of the power LED.

The double-sided substrate (FR-4 PCB) provides a PCB assembly (PCB Assy)which can help save a unit cost as compared with the expensive MC PCB(Metal core printed circuit board) and the thermal pad and can help makelighter the whole module members and can help obtain a good attachmentflatness of the printed circuit board.

The multi-through hole 230 is a through hole member which accommodates aheat transfer medium for the sake of transferring a high temperatureheat coming from the heat radiation point 190 of the power LED heatradiation portion 180 having a two-tiered structure, to the aluminumstructure 600 which is a heat radiation structure. At the upper side ofthe double-sided substrate (FR-4 PCB) 200 is formed one through hole 231at every portion where the power LED is positioned, and at the lowerside extended from one through hole 231 is formed a plurality of throughholes 232 a˜232 d by means of a punching process. At this time, it isnoted that the lower Cu thin surface 221 of the double-sided substrate(FR-4 PCB) 200 is not punched.

Here, the lower Cu thin surface 221 of the double-sided substrate (FR-4PCB) 200 is not punched the reasons that the high temperature heatcoming from the power LED can be transferred to the aluminum structure600, which is a large heat radiation structure, as it comes into contactwith the Pb-free cream solder 300 soldered (Pb soldering) by means of amovable high temperature equipment 400.

As shown in FIG. 3 (B), it shows a state that the Pb-free cream solder300 is filled in the through member with a multi-through hole of atwo-tiered structure by means of a punching process depending on theshape and size of the power LED in the double-sided substrate (FR-4 PCB)200.

The Pb-free cream solder 300 is a heat transfer medium with the functionof a heat slug 310 and is injected in the multi-through hole 230 as highas the height of the solder pad by using a mechanical device.

As shown in FIG. 3(C), it shows a state that a Pb-free cream solder 300is filled injected into the through member with a multi-through hole ofa two-tier structure by means of a punching process depending on theshape and size of the power LED 100 in the double-sized substrate (FR-4PCB) 200, and it is soldered (Pb soldering) using a movable hightemperature equipment 400.

The movable high temperature equipment 400 is a kind of equipment whichfixes by supplying a high temperature heat to the Pb-free cream solder300 by using a heat transfer medium and is featured in that the Pb-freecream solder 300 is soldered by positioning the power LED 100 at theelectrode plates (+ and −) after the Pb-free cream solder 300 issoldered, and the solder pad 320 connecting with the lead frame (oranode and cathode) of the power LED 100 is soldered at a hightemperature.

FIG. 4 is a view illustrating a PCB assembly (PCB Assy) 500 finishedbased on a method for producing a large lighting with a power LEDaccording to a preferred embodiment of the present invention.

As shown in FIG. 4, the PCB assembly (PCB Assy) 500 is a means which isformed by packaging the power LED 100, the double-sided substrate (FR-4PCB) 200 and the Pb-free cream solder 300, in other words, it is astructured means formed by forming an anode electrode as a fixing typecradle structure with a Pb soldering structure so that, by means of themovable high temperature equipment 400, the heat radiation point 190 ofthe heating portion 180 of the backside of the power LED 100 and thePb-free cream solder 300 injected into the multi-through hole 230 andthe lower Cu thin surface 221 of the double-sided substrate (FR-4 PCB)are integrated as one body and become a heat transfer medium.

FIG. 5 is a view illustrating a state that a PCB assembly 500 based on amethod for producing a large lighting with a power LED is fixed at analuminum structure 600 which is a large radiation structure according toa preferred embodiment of the present invention.

As shown in FIG. 5, the PCB assembly 500 is constructed so as tomaximize the heat radiation efficiency as a LED lighting as it isfixedly attached to the aluminum structure 600 which is a large heatradiation structure. In addition, it shows an actual size structurewhich can be used to manufacture a large LED lighting structure such asa streetlight by using it in multiple numbers.

In addition, FIG. 6 is a flow chart explaining a method for producing alarge lighting with a power LED of FIGS. 3(A), (B) and (C) through FIG.5.

As shown in FIG. 6, the method for producing a large lighting with apower LED comprises:

(A) a step S100 in which one through hole is formed by means of apunching process at part of an upper side in order for a double-sidedsubstrate not to be passed depending on the shape and size of the powerLED in the double-sided substrate (FR-4 PCB) 200 in which a Cu thinsurface 220, 221 is attached at the upper and lower portions made from aFR-4 material 210 having a solder pad 320 which can fix a lead frame(+pole and −pole) of the power LED.

(B) a step S200 in which a plurality of through holes 232 a˜232 d areformed by passing through the remaining parts of the double-sidedsubstrate extended from one through hole 231, so a multi-through hole230 of a two-tiered structure is formed in such a way that a lower Cuthin surface 221 of a double-sided substrate (FR-4 PCB) 200 is notpunched.

As shown in FIG. 7, the multi-through hole 230 of a two-tiered structureis characterized in that it is formed at a portion vertically matchingwith the heat radiant point 190 of the power LED heating portion 180(S210).

In addition, the multi-through hole 230 of a two-tiered structure ischaracterized in that it is previously punched at the time of processingthe double-sided substrate (FR-4 PCB) (S220).

In addition, the multi-through hole 230 of a two-tiered structure ispunched in a circular shape 240 or a quadrangle shape 250 depending onthe shape and size of the power LED (S230).

In addition, one through hole 231 is characterized in that the Pb-freecream solder 300 injected into one through hole 231 becomes a heattransfer medium of a Pb soldering structure by means of the movable hightemperature equipment 400, thus accumulating the high temperature heatcoming from the heat radiation point 190 of the power LED heat radiationportion 180 (S240).

The plurality of the through holes 232 a˜232 d are characterized in thatthey can fast disperse, in a multiplexing way, a high temperature heataccumulated at one through hole 231 (S250).

The key technical concept of the embodiment of the present inventionlies in that there is provided a multi-through hole 230 of a two-tieredstructure which is equipped with one through hole 231 and a plurality ofthe through holes 232 a˜232 d. In other words, the heat coming from theheat radiation point 190 of the power LED heat radiation portion 180 ischaracterized in that the current increases in order to enhance thelight emitting efficiency in case of the large LED lighting such as astreetlight, and as the current rises, the temperature of the heatradiation point of the heating portion increases. The preset inventionis directed to multiplying the heat radiation effects in such a way thatthe heat radiation coming from one through hole 231 accommodating a heattransfer medium having a function of a heat slug with a larger volumethan the plurality of the through holes 232 a˜232 d is fast accumulatedat the time it emits, and the high temperature radiation having a highthermal expansion coefficient is dispersed in a multiplexing way towardthe plurality of the trough holes 232 a˜232 d having a smaller volumethan one through hole 231 as in the Bernoulli's theorem in which theflowing speed becomes faster when a fluid passes from a wider tube to anarrow tube.

In other words, the heat coming from the heat radiation point 190 of thepower LED heating portion 180 is firstly, quickly accumulated at aPb-free cream solder 300 injected in one through hole 231 having a heatslug function. At this time, the heat radiation of the power LEDaccumulated at one through hole 231 has a high thermal expansioncoefficient. The Pb-free cream solder 300 injected in the plurality ofthe through holes 232 a˜232 d can secondary, quickly radiate the heataccumulated at one through hole 231, thus disperse, in a multiplexingway, the heat accumulated in one through hole 231 now what the Pb-freecream solder 300 is directly Pb-soldered with the lower cu thin surface221 of the double-sided substrate (FR-4 PCB) 200 by means of asoldering. In addition, the heat radiation effects can be thirdlymaximized by spreading over a wider heat radiation range in such a waythat it is fixedly attached with the lower Cu thin surface 221 of thedouble-sided substrate (FR-4 PCB) 200 and the aluminum structure 600which is a large heat radiation structure.

The above-mentioned technical construction is a unique heat radiationdesign technology developed by the applicant of the present applicationwhich is not disclosed so far in the industry.

There is provided (C) a step S300 in which a Pb-free cream solder 300 isinjected in the multi-through hole 230 of a two-tiered structure as muchas the height of the solder pad for the purpose of providing a heat slugfunction by using a mechanical device.

As shown in FIG. 8, the Pb-free cream solder 300 is characterized inthat it is injected into the double-sided substrate (FR-4 PCB) 200before the power LED is engaged (S310).

There is provided (D) a step S400 in which a PCB assembly (PCB Assy) 500is finished by soldering a Pb-free cream solder 300 for the purpose ofensuring that the heat radiation point of the heating portion of abackside of the power LED and the Pb-free cream solder 300 and the lowerCu thin surface of the double-sided substrate are integrated, by using amovable high temperature equipment 400 after the power LED 100 isproperly positioned at the pole plates following the injection of thePb-free cream solder 300.

There is provided (E) a step S500 in which the PCB assembly 500 isengaged to an aluminum structure 600 which is a large heat radiationstructure, thus maximizing the heat radiation efficiency of the LEDlighting.

As shown in FIG. 8, the PCB assembly 500 and the aluminum structure 600which is a large heat radiation structure are characterized in that theyare engaged by a soldering (Pb soldering) or a thermal grease (S510).

According to the preferred embodiment of the present invention, thepresent invention is characterized in that it is possible to propose anew applied technology on a heat radiation design method of a backsideof a power LED device for the purpose of producing a large LED lightingappliance such as a streetlight in such a way that the high temperaturecan be fast dispersed, in a multiplexing way, into the temperature ofthe atmosphere, the high temperature heat being accumulated by means ofa heat radiation point of a heating portion of a backside of a power LEDand a thermal transfer medium in a multi-through hole helping come intodirect contact with an aluminum structure which is a large heatradiation structure.

As the present invention may be embodied in several forms withoutdeparting from the spirit or essential characteristics thereof, itshould also be understood that the above-described examples are notlimited by any of the details of the foregoing description, unlessotherwise specified, but rather should be construed broadly within itsspirit and scope as defined in the appended claims, and therefore allchanges and modifications that fall within the meets and bounds of theclaims, or equivalences of such meets and bounds are therefore intendedto be embraced by the appended claims.

1. A method for producing a large lighting with a power LED, comprising:(a) a step in which one through hole is formed by means of a punchingprocess at part of an upper side in order for a double-sided substratenot to be passed depending on the shape and size of the power LED in thedouble-sided substrate (FR-4 PCB) in which a Cu thin surface is attachedat the upper and lower portions made from a FR-4 material having asolder pad which can fix a lead frame (+pole and −pole) of the powerLED; (b) a step in which a plurality of through holes are formed bypassing through the remaining parts of the double-sided substrateextended from one through hole, so a multi-through hole of a two-tieredstructure is formed in such a way that a lower Cu thin surface of adouble-sided substrate (FR-4 PCB) is not punched; (c) a step in which aPb-free cream solder is injected in the multi-through hole of atwo-tiered structure as much as the height of the solder pad for thepurpose of providing a heat slug function by using a mechanical device;(d) a step in which a PCB assembly (PCB Assy) is finished by soldering aPb-free cream solder for the purpose of ensuring that the heat radiationpoint of the heating portion of a backside of the power LED and thePb-free cream solder and the lower Cu thin surface of the double-sidedsubstrate are integrated, by using a movable high temperature equipmentafter the power LED is properly positioned at the pole plates followingthe injection of the Pb-free cream solder; and (e) a step in which thePCB assembly is engaged to an aluminum structure which is a large heatradiation structure, thus maximizing the heat radiation efficiency ofthe LED lighting.
 2. A method for producing a large lighting with apower LED according to claim 1, wherein said multi-through hole of atwo-tiered structure is punched at a portion where is vertically matchedwith a heat radiation point of the power LED heating portion.
 3. Amethod for producing a large lighting with a power LED according toclaim 2, wherein said multi-through hole of a two-tiered structure ispreviously punched when processing the double-sided substrate (FR-4PCB).
 4. A method for producing a large lighting with a power LEDaccording to claim 3, wherein said multi-through hole of a two-tieredstructure is punched in a circular shape or a quadrangle shape.
 5. Amethod for producing a large lighting with a power LED according toclaim 1, wherein said one through hole has a function by which thePb-free cream solder injected in one through hole becomes a thermaltransfer medium of a Pb soldering structure by means of a movable hightemperature equipment, thus fast accumulating a high temperature heatcoming from a heat radiation point of the power LED heating portion. 6.A method for producing a large lighting with a power LED according toclaim 5, wherein the plurality of said through holes have functions ofdispersing, in a multiplexing way and a fast flow speed type, a hightemperature heat fast accumulated in one through hole.
 7. A method forproducing a large lighting with a power LED according to claim 1,wherein said PB-free cream solder is injected before the power LED isengaged to the double-sided substrate (FR-4 PCB).
 8. A method forproducing a large lighting with a power LED according to claim 1,wherein said PCB assembly and said aluminum structure, which is a largeheat radiation structure, are fixedly attached by a soldering or athermal grease.